United Microelectronics Corporation Q3 2025 Financial Report and Bond Issuance

United Microelectronics Corporation (UMC) has announced the date for its Q3 2025 consolidated financial report board meeting, scheduled for October 29, 2025. The notice for the meeting was issued on October 21, 2025. Additionally, UMC has provided a supplement to its unsecured straight corporate bond issuance, authorized by the Board of Directors on April 23, 2025. The bond issuance totals NT$5,000 million, with a face value of NT$1 million per bond, a fixed coupon rate of 1.70% p.a., and a 3-year issuance period. The funds raised will be used for debt repayment. The bonds will be publicly offered through underwriters, with CTBC Bank Co., Ltd as the trustee and Yuanta Securities Co., Ltd as the lead underwriter.